Sputtering target (China)

SPUTTERING TARGET: Serve as the raw materials for the sputter deposition of a variety of thin films and coatings used in the microelectronic, flat panel display, data storage, optical glass coating, and other industries, the core process technologies used in coating material and target manufacturing include:

casting (vacuum or atmospheric), rolling, forging (hot / cold), pressing (cold, hot, uniaxial or isotropic), sintering, spraying (plasma, wire). CAM runs all these process technologies, including cutting, milling, sawing, grinding, etc.



1.) Metal sputtering target:

Gold, Au, Silver, Ag, Osmium, Os, Platinum, Pt, Palladium, Pd, Iridium, Ir, Ruthenium, Ru, Rhenium, Re, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sc, Y, Silicon, Si, Tellurium, Te, Bismuth, Bi, Tin, Sn, Zinc, Zn, Sulphur, S, Graphite, C, Boron, B, Lead, Pb, Antimony, Sb, Selenium, Se, Chromium, Cr, Cobalt, Co, Aluminum, Al, Nickel, Ni, Titanium, Ti, Tungsten, W, Molybdenum, Mo, Tantalum, Ta, Niobium, Nb, Zirconium, Zr, Hafnium, Hf, Vanadium, V, Germanium, Ge, Indium In, Copper, Cu, Iron, Fe, Manganese, Mn, , Magnesium, Mg, Barium, Ba, Cadmium, Cd, Calcium, Ca, Strontium, Sr, Beryllium, Be.



2.) Oxide sputtering target:

La2O3, CeO2, Nd2O3, Sm2O3, Eu2O3, Gd2O3, Tb4O7, Dy2O3, Ho2O3, Er2O3, Tm2O3, Yb2O3, Lu2O3, Sc2O3, Y2O3, Ta2O5, Nb2O5, Ga2O3, V2O5, ZrO2 doped with Ti, WO3, HfO2, MgO, Al2O3, Indium Tin Oxide, ITO (In2O3-SnO2), ZnO, Al2O3 doped ZnO (AZO), ZAO, Ga2O3 doped ZnO (GZO), LSM, ZrO2-Y2O3 stabilized (YSZ), Bi2O3, Cr2O3, MoO, MoO3, NiO, SiO, Cr-SiO, SiO2, TiO, TiO2, Ti2O3, Ti3O5, CuO/Al2O3, Sb2O3, BaO, BaTiO3, CaO, Fe2O3, Fe3O4, PbO, PbTiO3, PbZrO3, LiNbO3, SrO, SrTiO3, SrZrO3, SrBaTiO3, PZT (Plumbum Zirconate Titanate), SrRuO3, LaNiO3.



3.) (Boride, Carbide, Nitride, Fluoride, Silicide, Sulfide) sputtering target

LaB6, ZrB2, CrB2, TiB2, HfB2, Mo2B5, TaB2, NbB2, W2B, WB, VB2

TiC, SiC, WC, B4C, TaC, ZrC, Cr3C2, HfC, Mo2C, VC

LaN, CeN, PrN, NdN, SmN, EuN, GdN, TbN, DyN, HoN, ErN, TmN, YbN, LuN, ScN, YN, Si3N4, AlN, BN, BN/SiC mixture, HfN, TaN, NbN, ZrN, TiN, VN

LaF3, CeF3, NdF3, YF3, NaF, KF, BaF2, AlF3, LiF, CaF2, SrF3, SrF2, MgF2

Mo5Si3, MoSi2, Ta5Si3, TaSi2, Nb5Si3, NbSi2, CrSi2, Cr3Si, HfSi2, TiSi2, Ti5Si3, ZrSi2, WSi2, VSi2, V3Si, NiSi,

CdS, ZnS, ZnS:Mn, In2S3, Sb2S3, PbS, MoS2, TaS2, WS2



4.) Alloy sputtering target:

NiYb, Ni2Yb, Ni3Yb, Ni-Yb, Co-Ni, V-Ni, Cr-Ni, Ti-Ni, Fe-Ni, Co-Ni-Cr, Co-Cr-Ta, Ho-Cu, Ce-Cu, Fe50Mn50, Ni81Fe19, Ce-Gd, Sm-Fe, Sm-Co, Sm-Zr, Gd-Fe, Fe-Hf, Tb-Fe, Dy-Fe, Dy-Co, Gd-Fe, Gd-Fe-Co, Dy-Fe-Co, Tb-Fe-Co, Nd-Fe-Co, Nb-Zr, Zr-Al, Al-Nd, Al-Ta, Al-V, Al-Mo, Al-Si, Al-Cu, Al-Si-Cu, Al-Ti, Al-Ag, Al-Mg, Al-Mg-Si, Al-Si-Cu, Zn-Al, Ce-Gd, Ce-Sm, CoZr, CoCr, CoNi, CoPt, CoNiCr, CoNiPt, Co-Fe, FeCoB, CoTaZr, CoNbZr, CoCrMo, CrV, CrB, CrSi, Cr-Cu, In-Sb, InAs, InP, InSn, MnFe, MnNi, NdDyFeCo, Ni-Cr, Ni-Mn, Ni-Cr-Si, Ni-Cr-Fe, Ni-Fe, Ni-Ti, Ni-V, Ni-Al, TbGdFeCo, TiAl, Ti-Si, Ti-Al, Ti-Al-Y, Ti-Al-V, Ti-Ni, Ti-Zr, TiSi2, W-Ti, W-Si, V-Al, Zr-Ti, Zr-Ni, Zr-Nb, Zr-Al, Zr-Cu, Zr-Y